UV Spectroscopy Team at USU
Uncovering new behaviors and validating novel models of electron and phonon transport in nanoscale geometries using a suite of unique spectroscopies based on coherent ultrafast, ultraviolet light pulses.

Research Overview
To develop next-generation computer chips, faster communication devices, robust solid-state batteries, and quantum computers, we desperately need a better understanding of how energy—in the form of heat, electricity, or magnetic interactions—flows through materials over ultra-small scales. Today’s transistors that power our electronic devices have dimensions much smaller than the thickness of a human red-blood cell and can generate heat fluxes greater than the surface of the sun! [1] However, our theoretical calculations cannot predict this intense behavior and our traditional tools cannot probe the physics.
In the UV Spectroscopy lab at USU, we build novel and cutting-edge measurement techniques that harness ultraviolet lasers. By using ultrafast infrared lasers, we can drive nonlinear processes to create laser-like light at wavelengths that is traditionally inaccessible. These ultraviolet spectroscopy tools can observe energy flow at incredible length- and time-scales: we can ‘see’ physics at the intersection of the ultra-small (nanometers) and ultra-fast (femtoseconds) scales. We use these unique tools to test new models of the energy flow and condensed matter physics, along with characterizing the properties of future materials. In recent work, we measured phonons—quantized vibrations of a solid which carry heat—traveling through nanoscale constrictions allowing us to build new models of energy carrier dynamics and reveal new understanding of exotic energy transport behavior.
​​​Our research group studies condensed matter and material physics using novel tools that harness advances in nonlinear, quantum, and optical physics. We perform cross-cutting research that is both fundamental with near-future applications in fields including mechanical, electrical, aerospace, and materials engineering.​
[1] Warzoha et al. Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging. Journal of Electronic Packaging, Transactions of the ASME 2021, 143 (2), 020804.